Diamond Wire Wafer Slicing Machine-Dalian Linton NC Machine Co., Ltd
Diamond Wire Wafer Slicing Machine

Diamond Wire Wafer Slicing Machine-Dalian Linton NC Machine Co., Ltd

Main Parameter
Process Capability
Length(mm): max 600 single-row
Workpiece size(mm): max 156 x 156
Slice thickness(mm): 0.10~0.20
Wire running mode reciprocating
Wire diameter φ0.10~φ0.145mm
Wire speed max 1200m/min
Acceleration time 3S
Wire tension 10~40N
Wire tension control mode servo motor control
Wire storage Φ0.12mm 50km
Cutting roller number 2 pcs
Cutting roller center distance 370mm
coolant (cutting fluid) water base surfactant
coolant tank capacity 320L
coolant flow 210L/min
Travel of worktable 260mm
Worktable feed speed 0.1~3mm/min
Worktable rapid traverse speed max 250mm/min
Board of workpiece size 660mm×1
Cooling water supply pressure 0.35~0.5Mpa
Cooling water return pressure < 0.15 Mpa
Cooling water temperature 8℃~12℃
Cooling water flow max 20m3/h
Air pressure 0.4~0.6Mpa
Air exhaust max 600NL/min
Power capacity three-phasefive-wire,380V/50HZ
Machine rated current 280A
Machine rated power 122Kw
Machine weight(Kg) about 12 tons
Dimensions (mm) 4340(L)×2470(W)×3110(H)

 

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